Phoenix, Arizona
United States
9
2025-01-02
The entities that hold a legal rights for patent applications filed by inventor Steill Jason:
Jason Steill from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:
HYBRID METALLIZATION SURFACES FOR INTEGRATED CIRCUIT PACKAGES
#2 | 2024-07-04PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS
#3 | 2024-06-06METHOD OF FORMING A PACKAGE SUBSTRATE
#4 | 2024-01-04SINX BASED SURFACE FINISH ARCHITECTURE
#5 | 2024-01-04POCKETED COPPER IN FIRST LAYER INTERCONNECT AND METHOD
#6 | 2023-12-28ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRONIC PACKAGES
#7 | 2023-12-28SINGLE LITHOGRAPHY METHODS FOR INTERCONNECT ARCHITECTURES
#8 | 2023-12-28MULTI-PATHWAY ROUTING VIA THROUGH HOLE
#9 | 2022-03-31Selectively roughened copper architectures for low insertion loss conductive features
5368155 ⎘