Stein
Germany
11
2025-03-13
The entities that hold a legal rights for patent applications filed by inventor Palm Petteri:
Petteri Palm from Stein, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE
#2 | 2024-10-03SEMICONDUCTOR PACKAGE HAVING AN ELECTRICALLY INSULATING CORE WITH EXPOSED GLASS FIBRES
#3 | 2023-08-10Semiconductor module having a multi-branch switch node connector
#4 | 2023-07-27Power electronic assembly having a laminate inlay and method of producing the power electronic assembly
#5 | 2023-05-25Electrostatic discharge protection of electronic component embedded in laminate of printed circuit board
#6 | 2022-11-24ELECTRONIC DEVICE WITH CASTELLATED BOARD
#7 | 2022-11-17Semiconductor package with non-uniformly distributed vias
#8 | 2022-07-21Pre-packaged chip, method of manufacturing a pre-packaged chip, semiconductor package and method of manufacturing a semiconductor package
#9 | 2022-04-21Stacked transistor chip package with source coupling
#10 | 2022-04-07Semiconductor module
#11 | 2022-03-31Semiconductor device module having vertical metallic contacts and a method for fabricating the same
5368178 ⎘