Whitney Bryks

BOTTOM-UP THROUGH GLASS VIA PLATING WITH COATED LIQUID ADHESIVE ON GLASS SUBSTRATE

MICROELECTRONIC ASSEMBLIES INCLUDING A PARTIAL LINER IN THROUGH-GLASS VIAS

MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOPOLYMER LINER IN THROUGH-GLASS VIAS

Conformally Plated TGVs Filled with Conductive Plug Materials

GLASS ETCH PROTECTION AND SEWARE REDUCTION BY COATING PROTECTION

HYBRID PANEL WITH A GLASS SUBSTRATE

FABRICATING INTEGRATED CIRCUIT PACKAGES WITH GLASS CORE HYBRID PANELS

AUTOMATED LAMINATION LINK FOR HYBRID PANEL CONVERSION OF GLASS CORE PANEL

HYBRID PANEL WITH A GLASS SUBSTRATE AND PLATED FRAME

INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH REINFORCED GLASS CORES

SUBSTRATE WITH COMPONENT EMBEDDED IN A BLIND CAVITY

MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED GLASS PATCH WITH INTEGRATED CAPACITOR

EMBEDDED DEEP TRENCH CAPACITORS IN INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES

LIQUID-BASED METHOD FOR EMBEDDING COMPONENTS IN THICK SUBSTRATES

MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES

APPARATUS AND SYSTEM FOR COATING OF GLASS SUBSTRATE HAVING A PLURALITY OF THROUGH-HOLES

MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GLASS CORES

MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATION IN GLASS CORES

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES

THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES

GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS

METHODS AND APPARATUS FOR EDGE PROTECTED GLASS CORES

FORMING POROUS DIELECTRIC STRUCTURES WITH SPATIALLY-CONTROLLED POROSITY

MEMS DIES EMBEDDED IN GLASS CORES

IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS

ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES

DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES

IN CORE LARGE AREA CAPACITORS

STRUCTURE AND PROCESS FOR WARPAGE REDUCTION

SUBSTRATE ARCHITECTURE FOR ENHANCED ELECTROSTATIC CHUCKING

SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE

INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES

CARRIER CHUCK AND METHODS OF FORMING AND USING THEREOF

HIGH ASPECT RATIO TGV SUBSTRATES THROUGH DIRECT HYBRID BONDING OF THIN TGV SUBSTRATES

MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING

SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES

POROUS POLYMER DIELECTRIC LAYER ON CORE

LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE INTERCONNECTS

SYSTEM FOR COATING METHOD

Dry film lamination with dynamic feedback control

SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT

METHOD AND APPARATUS FOR REMOVING LASER DEBOND RESIDUE FROM SUBSTRATE

INTERPOSER WITH A GLASS CORE THAT INCLUDES OPENINGS AND THROUGH GLASS VIAS

POSITION CONTROLLED WAVEGUIDES AND METHODS OF MANUFACTURING THE SAME

OPTICAL WAVEGUIDE FORMED WITHIN IN A GLASS LAYER

OPTICAL WAVEGUIDE EDGE COUPLING WITHIN A SUBSTRATE

DOUBLE-SIDED GLASS SUBSTRATE WITH A HYBRID BONDED PHOTONIC INTEGRATED CIRCUIT

COMPOSITE IC DIE PACKAGE INCLUDING IC DIE DIRECTLY BONDED TO FRONT AND BACK SIDES OF AN INTERPOSER

Electronic substrates having heterogeneous dielectric layers