Junxin Wang

City:

Chandler, Arizona

Country:

United States

Published Applications:

Last publication date:

2023-02-02

Top Assignees for applications by Junxin Wang

The entities that hold a legal rights for patent applications filed by inventor Wang Junxin:

Junxin Wang from Chandler, US has applied for patents for these inventions. The list has both pending applications and granted patents:

COMPOSITE IC DIE PACKAGE INCLUDING IC DIE DIRECTLY BONDED TO FRONT AND BACK SIDES OF AN INTERPOSER

Electronic substrates having heterogeneous dielectric layers

InventorID:

5397708 ⎘