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Inventor profile of:

Eric ERIKE

City:

Mesa, Arizona

Country:

United States

Published Applications:

8

Last publication date:

2026-03-12

Top Assignees for applications by Eric ERIKE

The entities that hold a legal rights for patent applications filed by inventor ERIKE Eric:

  • INTEL CORPORATION 3 Santa Clara, CA United States

Recent patent applications by ERIKE Eric

Eric ERIKE from Mesa, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-03-12
US20260074455A1
Electricity

LAND GRID ARRAY (LGA) SOCKET PINS AND HOUSINGS

#2 | 2026-02-12
US20260047437A1
Electricity

IMPROVED SEMICONDUCTOR CHIP PACKAGE THERMO-MECHANICAL COOLING ASSEMBLY

#3 | 2025-01-09
US20250014980A1
Electricity

INTERLINKED GROUND WELLS WITH SPECIALIZED PATTERNS FOR LIQUID METAL INTERPOSER

#4 | 2024-12-05
US20240404896A1
Electricity

PATCH INTERPOSER MOLD DESIGN FOR LIQUID METAL CARRIER ARRAY

#5 | 2024-09-05
US20240297119A1
Electricity

LIQUID METAL CONNECTION DEVICE AND METHOD

#6 | 2024-05-30
US20240179832A1
Electricity

MULTI-ENTRY SOCKET POWER DELIVERY STRUCTURE AND BACKPLATE

#7 | 2022-07-07
US20220216561A1
Electricity

METHODS AND APPARATUS TO INCREASE STACKING PRESSURE IN BATTERY CELLS

#8 | 2022-06-30
US20220208645A1
Electricity

SEMICONDUCTOR CHIP PACKAGE THERMO-MECHANICAL COOLING ASSEMBLY

InventorID:

5453465 ⎘

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