Maik LOHMANN

City:

Soest

Country:

Germany

Published Applications:

Last publication date:

2026-04-16

Top Assignees for applications by Maik LOHMANN

The entities that hold a legal rights for patent applications filed by inventor LOHMANN Maik:

Maik LOHMANN from Soest, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE, DIE, AND DIE PACKAGE

SEMICONDUCTOR DIE WITH BOND PAD FORMED FROM NANOWIRES

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE, DIE, AND DIE PACKAGE

InventorID:

5470804 ⎘