Niranjan PINGLE

City:

Milpitas, California

Country:

United States

Published Applications:

Last publication date:

2026-05-07

Top Assignees for applications by Niranjan PINGLE

The entities that hold a legal rights for patent applications filed by inventor PINGLE Niranjan:

Niranjan PINGLE from Milpitas, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Integrated Process Sequence for Hybrid Bonding Applications

MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROCESS MODULES OR CHAMBERS

Integrated process sequence for hybrid bonding applications

MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROCESS MODULES OR CHAMBERS

Modular mainframe layout for supporting multiple semiconductor process modules or chambers

InventorID:

5496219 ⎘