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Inventor profile of:

Jaechoon Kim

City:

Incheon

Country:

South Korea

Published Applications:

Last publication date:

2026-03-12

Top Assignees for applications by Jaechoon Kim

The entities that hold a legal rights for patent applications filed by inventor Kim Jaechoon:

SAMSUNG ELECTRONICS CO., LTD. 8 Suwon-si, South Korea
UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY 2 Yongin-si, South Korea
SAMSUNG ELECTRONICS CO. LTD. 1 Suwon-si, Gyeonggi-do, South Korea
Samsung Electronics Co., Ltd 1 , South Korea

Recent patent applications by Kim Jaechoon

Jaechoon Kim from Incheon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-03-12

US20260076197A1

Electricity

SEMICONDUCTOR PACKAGE AND COOLING SYSTEM

#2 | 2025-03-20

US20250096061A1

Electricity

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

#3 | 2024-06-06

US20240186215A1

Electricity

Thermal interface material, method of manufacturing the same, and semiconductor packages including the same

#4 | 2023-06-08

US20230178450A1

Electricity

FILM PACKAGE

#5 | 2023-04-20

US20230124783A1

Electricity

SEMICONDUCTOR PACKAGE AND COOLING SYSTEM

#6 | 2023-03-23

US20230092410A1

Electricity

Semiconductor package and method of manufacturing the same

#7 | 2023-03-02

US20230063886A1

Electricity

SEMICONDUCTOR PACKAGE COMPRISING HEAT SPREADER

#8 | 2023-03-02

US20230060513A1

Electricity

SEMICONDUCTOR PACKAGE

#9 | 2022-04-28

US20220130761A1

Electricity

Integrated circuit semiconductor device

#10 | 2022-02-03

US20220037227A1

Electricity

Thermal interface material and semiconductor packages including the same

#11 | 2013-12-05

US20130321041A1

Electricity

Electronic device and method for controlling temperature thereof

InventorID:

554777 ⎘