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Inventor profile of:

Michael MURPHY

City:

Latham, New York

Country:

United States

Published Applications:

6

Last publication date:

2024-06-20

Top Assignees for applications by Michael MURPHY

The entities that hold a legal rights for patent applications filed by inventor MURPHY Michael:

  • TOKYO ELECTRON LIMITED 5 Tokyo, Japan

Recent patent applications by MURPHY Michael

Michael MURPHY from Latham, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-06-20
US20240201601A1
Physics

In-situ lithography pattern enhancement with localized stress treatment tuning using heat zones

#2 | 2023-11-09
US20230359128A1
Physics

In-situ lithography pattern enhancement with localized stress treatment tuning using heat zones

#3 | 2023-08-10
US20230251570A1
Physics

Selective Deprotection via Dye Diffusion

#4 | 2023-01-12
US20230008350A1
Electricity

METHOD OF ADJUSTING WAFER SHAPE USING MULTI-DIRECTIONAL ACTUATION FILMS

#5 | 2022-12-08
US20220388232A1
Performing operations; transporting

METHOD FOR REMOVING MATERIAL OVERBURDEN VIA ENHANCED FREEZE-LESS ANTI-SPACER FORMATION USING A BILAYER SYSTEM

#6 | 2022-10-20
US20220336226A1
Electricity

METHOD OF CORRECTING WAFER BOW USING A DIRECT WRITE STRESS FILM

InventorID:

5554379 ⎘

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