Eunsu LEE

City:

Asan-si

Country:

South Korea

Published Applications:

Last publication date:

2023-10-26

Top Assignees for applications by Eunsu LEE

The entities that hold a legal rights for patent applications filed by inventor LEE Eunsu:

Eunsu LEE from Asan-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

Semiconductor package including semiconductor chips stacked via conductive bumps

InventorID:

5572888 ⎘