🔗 Permalink

Inventor profile of:

Junwoo Park

City:

Asan-si

Country:

South Korea

Published Applications:

Last publication date:

2026-01-29

Top Assignees for applications by Junwoo Park

The entities that hold a legal rights for patent applications filed by inventor Park Junwoo:

SAMSUNG ELECTRONICS CO., LTD. 9 Suwon-si, South Korea
SAMSUNG ELECTRONICS CO., LTD. 1 Gyeonggi-Do, South Korea

Recent patent applications by Park Junwoo

Junwoo Park from Asan-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-01-29

US20260033334A1

Electricity

SEMICONDUCTOR PACKAGE

#2 | 2026-01-08

US20260011703A1

Electricity

PACKAGE SUBSTRATE HAVING PROTECTIVE LAYER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

#3 | 2025-08-07

US20250253163A1

Electricity

MOLDED PRODUCT FOR SEMICONDUCTOR STRIP AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

#4 | 2025-06-26

US20250210494A1

Electricity

SEMICONDUCTOR PACKAGE

#5 | 2023-08-17

US20230260926A1

Electricity

SEMICONDUCTOR PACKAGES HAVING FIXING MEMBERS

#6 | 2023-04-27

US20230131730A1

Electricity

PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

#7 | 2023-04-27

US20230127641A1

Electricity

Molded product for semiconductor strip and method of manufacturing semiconductor package

#8 | 2023-04-13

US20230114892A1

Electricity

SEMICONDUCTOR PACKAGE INCLUDING ELECTROMAGNETIC SHIELD STRUCTURE

#9 | 2023-03-16

US20230082412A1

Electricity

SEMICONDUCTOR PACKAGE

#10 | 2022-12-29

US20220415778A1

Electricity

Semiconductor package

#11 | 2022-11-17

US20220367416A1

Electricity

Semiconductor package having package substrate

InventorID:

5579164 ⎘