Hiroki TANAKA

METHODS AND ARCHITECTURES FOR MULTI-LAYER FILLED THROUGH-GLASS VIAS (TGVs)

THROUGH GLASS VIA LOCAL STRESS REDUCTION

THROUGH GLASS VIA LOCAL STRESS REDUCTION

MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOPOLYMER LINER IN THROUGH-GLASS VIAS

GLASS INTERPOSER OPTICAL MODULATOR DEVICE AND METHOD

SELECTIVE POROUS GLASS FOR GLASS SUBSTRATE SINGULATION

3D PRINTING OF GLASS CORE EDGE PROTECTION IN IC DEVICE PACKAGING

METHODS AND SYSTEMS FOR FORMING INTEGRATED CIRCUIT PACKAGES COMPRISING GLASS LAYERS WITH THIN SINGULATED PORTIONS

GLASS ETCH PROTECTION AND SEWARE REDUCTION BY COATING PROTECTION

EDGE COATING FOR GLASS CORE SUBSTRATE WITH A FRAME

EDGE COATING FOR GLASS CORE SUBSTRATE WITH AIR PRESSING FOR PROFILE CONTROL

GLASS CORE SUBSTRATE WITH EDGE BIAS

SOCKET ASSEMBLIES FOR SEMICONDUCTOR DEVICES

INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS-CORE SUBSTRATE

MICROELECTRONIC ASSEMBLIES INCLUDING A GLASS-CORE WITH POST-SINGULATION EDGE FEATURES

PLASMA-BASED GLASS PACKAGE DICING

GLASS CORES WITH TAPERED INSULATOR EDGES

EMBEDDED BRIDGE WITH PROTECTION LAYER FOR VIA FORMATION WITH BUMP PITCH SCALING

HYBRID PANEL WITH A GLASS SUBSTRATE

METHODS AND SYSTEMS FOR FORMING INTEGRATED CIRCUIT PACKAGES COMPRISING GLASS LAYERS

FRAMES FOR GLASS CORE HYBRID PANELS

THIN GLASS CORE PANELS IN CIRCUIT DEVICE PACKAGING

FABRICATING INTEGRATED CIRCUIT PACKAGES WITH GLASS CORE HYBRID PANELS

INORGANIC RECONSTITUTION CARRIER PANEL

HYBRID PANEL WITH A GLASS SUBSTRATE AND PLATED FRAME

INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH REINFORCED GLASS CORES

LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING

MULTI-DIE ASSEMBLIES WITH GLASS SUPPORT STRUCTURES

METHODS AND ARCHITECTURES FOR SHALLOW FIDUCIAL AND METAL DEFINED PAD DESIGNS

DEEP TRENCH CAPACITORS IN MULTI-CORE INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES

VERTICALLY EMBEDDED COMPONENTS IN PACKAGE SUBSTRATES

PASSIVE COMPONENT ASSEMBLY FOR THICKNESS MODIFICATION TO MATCH CORE THICKNESS

TECHNOLOGIES FOR CONNECTED COMPONENTS EMBEDDED IN A SUBSTRATE CORE

DIE AND CONDUCTIVE VIAS EMBEDDED IN A SUBSTRATE

METHODS AND APPARATUS TO EMBED SEMICONDUCTOR DEVICES IN CORES OF PACKAGE SUBSTRATES

PEDESTAL STRUCTURE FOR PASSIVE CIRCUIT COMPONENT STRUCTURE

TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRATE CORE

RESIST TENTING AND PLATING IN CORE CAVITY FOR COMPONENT ATTACHMENT

DIE WITHIN A HOLE IN A SUBSTRATE CORE ATTACHED TO METAL FEATURES OVER THE HOLE

MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES

VERTICALLY EMBEDDED PRE-FORMED DEEP TRENCH CAPACITOR MODULES

MICROELECTRONIC ASSEMBLIES WITH POST-SINGULATION EDGE FEATURES IN GLASS CORES

MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GLASS CORES

DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS

POROUS LINERS FOR THROUGH-GLASS VIAS AND ASSOCIATED METHODS

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDUCTION

ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND RELATED METHODS

GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS

DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY

GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED METHODS

LOW STRESS THROUGH GLASS VIAS (TGVS)

METHODS AND APPARATUS FOR EDGE PROTECTED GLASS CORES

SELECTIVE UNDERCUT FOR GLASS CORE SUBSTRATE BRIDGE FIRST LEVEL INTERCONNECT (FLI) BUMP PLATING

AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTERPOSER

PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING REPLACEABLE FIBER CONNECTORS

CO-PACKAGING OF PHOTONIC & ELECTRONIC INTEGRATED CIRCUIT DIE

LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE INTEGRATED CIRCUIT PACKAGES HAVING SILICON NITRIDE ADHESION PROMOTERS

ELECTRO-OPTICAL CIRCUITS WITH MODULAR SWITCHABLE PHOTONIC INTERFACE

APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS

MICROELECTRONIC ASSEMBLY HAVING ANTIFERROMAGNETIC FILM STRUCTURE THEREIN

Microelectronic Assembly Including Interconnect Bridges with Through Vias Embedded Therein

INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS CORE WITH A FILTER STRUCTURE

PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES

PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES

PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS

PACKAGE SUBSTRATE WITH DUAL DAMASCENE BASED SELF-ALIGNED VIAS

MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE

HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STRUCTURES

MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER

HYBRID PLASMONIC WAVEGUIDE AND METHOD FOR HIGH DENSITY PACKAGING INTEGRATED WITH A GLASS INTERPOSER

DIRECTLY COUPLED OPTICAL INTERPOSER

SURFACE FINISH WITH METAL DOME

DFR OVERHANG PROCESS FLOW FOR ELECTROLYTIC SURFACE FINISH FOR GLASS CORE

ELECTROLYTIC SURFACE FINISH ARCHITECTURE

IC PACKAGE WITH LEDS

MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES

COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS

CAVITY-LESS INTERCONNECT COMPONENT ON GLASS CORE

PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCONNECTS

TECHNOLOGIES FOR SIGNAL AMPLIFICATION FOR A PHOTONIC INTEGRATED CIRCUIT

ELECTRICALLY COUPLED TRENCH CAPACITORS WITHIN A SUBSTRATE

INTEGRATED OPTICAL COUPLER

DIELECTRIC LAYER SEPARATING A METAL PAD OF A THROUGH GLASS VIA FROM A SURFACE OF THE GLASS

HYBRID CARRIER FOR ELECTRONIC SUBSTRATE TECHNOLOGIES

Magneto-optical Kerr effect interconnects for photonic packaging

CAPACITORS IN A GLASS SUBSTRATE