Douglas M. Scott

City:

Phoenix, Arizona

Country:

United States

Published Applications:

Last publication date:

2015-09-24

Top Assignees for applications by Douglas M. Scott

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Douglas M. Scott from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:

METHOD FOR APPLYING A FINAL METAL LAYER FOR WAFER LEVEL PACKAGING AND ASSOCIATED DEVICE

Electroplating using dielectric bridges

Method for applying a final metal layer for wafer level packaging and associated device

InventorID:

564361 ⎘