Yi Yang

NEURAL NETWORK WITH POINT GRID CONVOLUTIONAL LAYER

TECHNOLOGIES FOR INTEGRATED GRADED INDEX LENSES IN PHOTONIC CIRCUITS

DIRECT PLATING OF COPPER ON DIELECTRICS FOR GLASS CORE PLATING

POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES

INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION

EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS

NANOROD COATING BETWEEN TWO OPTICAL MEDIUMS

SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS

SINX BASED SURFACE FINISH ARCHITECTURE

SUBSTRATE HAVING ONE OR MORE ELECTRICAL INTERCONNECTS

SILICIDE AND SILICON NITRIDE LAYERS BETWEEN A DIELECTRIC AND COPPER

POCKETED COPPER IN FIRST LAYER INTERCONNECT AND METHOD

SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS

EDGE DELAMINATION AND CRACK PREVENTION METHODS FOR SINX AND TI-CU ENABLED PACKAGES

STRESS-REDUCING DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRONIC PACKAGES

ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRONIC PACKAGES

SINGLE LITHOGRAPHY METHODS FOR INTERCONNECT ARCHITECTURES

ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE

TECHNOLOGIES FOR THIN FILM RESISTORS IN VIAS

GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS

GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS

SURFACE FUNCTIONALIZATION OF SINX THIN FILM BY WET ETCHING FOR IMPROVED ADHESION OF METAL-DIELECTRIC FOR HSIO

PLASMA-INDUCED SURFACE FUNCTIONALIZATION OF SINX THIN FILM FOR IMPROVED ADHESION OF METAL-DIELECTRIC FOR HSIO

MODIFICATION OF SINX THIN FILM FOR IMPROVED ADHESION OF METAL-DIELECTRICS FOR HSIO PACKAGING

METHODS AND APPARATUS TO IMPROVE ADHESION BETWEEN METALS AND DIELECTRICS IN CIRCUIT DEVICES