Munich
Germany
14
2025-07-31
The entities that hold a legal rights for patent applications filed by inventor LANGENBUCH Michael:
Michael LANGENBUCH from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
METHODS AND APPARATUS FOR OPTICAL CHIP-TO-CHIP COMMUNICATIONS
#2 | 2025-01-02Integrated Waveguides for Semiconductor Technology
#3 | 2025-01-02Routing and Passive Components in a Direct Bonding Layer
#4 | 2025-01-02INTEGRATED CIRCUIT CONNECTION AS A DEVICE
#5 | 2024-12-26INTEGRATED CAPACITOR
#6 | 2024-12-26GLASS LAYERS AND CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES
#7 | 2024-12-26INTEGRATED CAPACITOR
#8 | 2024-12-26DIELECTRIC MATERIAL AND A MOLD COMPOUND WITH DIFFERENT DIELECTRIC CONSTANTS COUPLED TO A DIE THAT INCLUDES INTEGRATED CIRCUITRY
#9 | 2024-11-21METHODS AND APPARATUS FOR IMPLEMENTING CAPACITORS IN SEMICONDUCTOR DEVICES
#10 | 2023-06-22TRANSFORMERS BASED ON BURIED POWER RAIL TECHNOLOGY
#11 | 2023-06-22BURIED POWER RAILS INTEGRATED WITH DECOUPLING CAPACITANCE
#12 | 2023-06-22INDUCTORS AND TRANSFORMERS FORMED BY BURIED POWER RAILS
#13 | 2023-03-30Back Side Power Supply for Electronic Devices
#14 | 2022-11-17Apparatus, Device, Method and Computer Program for an Integrated Development Environment
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