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Inventor profile of:

Wei Wei

City:

Chandler, Arizona

Country:

United States

Published Applications:

8

Last publication date:

2026-03-19

Top Assignees for applications by Wei Wei

The entities that hold a legal rights for patent applications filed by inventor Wei Wei:

  • INTEL CORPORATION 3 Santa Clara, CA United States

Recent patent applications by Wei Wei

Wei Wei from Chandler, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-03-19
US20260078046A1
Chemistry; metallurgy

PLASMA-BASED GLASS PACKAGE DICING

#2 | 2025-06-05
US20250183180A1
Electricity

DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS

#3 | 2025-03-27
US20250105074A1
Electricity

GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED METHODS

#4 | 2024-07-04
US20240222259A1
Electricity

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE INTEGRATED CIRCUIT PACKAGES HAVING SILICON NITRIDE ADHESION PROMOTERS

#5 | 2024-07-04
US20240222136A1
Electricity

ELECTRICAL LAYER WITH ROUGHENED SURFACES

#6 | 2024-01-04
US20240006300A1
Electricity

SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS

#7 | 2024-01-04
US20240006285A1
Electricity

SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS

#8 | 2023-03-30
US20230101629A1
Electricity

OMNI DIRECTIONAL INTERCONNECT WITH MAGNETIC FILLERS IN MOLD MATRIX

InventorID:

5701611 ⎘

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