Suwon-si
South Korea
22
2026-03-05
The entities that hold a legal rights for patent applications filed by inventor LEE Eunsu:
Eunsu LEE from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
RESIST UNDERLAYER COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION
#2 | 2026-02-05SEMICONDUCTOR PACKAGE
#3 | 2025-11-27RESIST UNDERLAYER COMPOSITIONS AND METHODS OF FORMING PATTERNS USING THE COMPOSITIONS
#4 | 2025-11-13RESIST UNDERLAYER COMPOSITIONS AND METHODS OF FORMING PATTERNS USING THE COMPOSITIONS
#5 | 2025-06-26SEMICONDUCTOR PACKAGE
#6 | 2025-06-12SEMICONDUCTOR PACKAGE
#7 | 2025-04-24RESIST UNDERLAYER COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION
#8 | 2025-03-20RESIST UNDERLAYER COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION
#9 | 2025-02-27RESIST UNDERLAYER COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION
#10 | 2025-02-06SUBSTRATE PACKAGE
#11 | 2025-01-30SEMICONDUCTOR PACKAGE
#12 | 2025-01-02SEMICONDUCTOR PACKAGE
#13 | 2024-12-26SEMICONDUCTOR PACKAGE
#14 | 2024-11-14SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF CHIPS SEQUENTIALLY STACKED ON A PACKAGE SUBSTRATE BY AN ADHESIVE FILM AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
#15 | 2024-10-10SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE
#16 | 2024-09-26SEMICONDUCTOR PACKAGE
#17 | 2024-07-11SEMICONDUCTOR PACKAGES
#18 | 2024-06-20SEMICONDUCTOR PACKAGE
#19 | 2024-04-25SEMICONDUCTOR PACKAGES
#20 | 2024-03-21SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#21 | 2023-11-02SEMICONDUCTOR PACKAGE
#22 | 2023-04-13SEMICONDUCTOR PACKAGE
5711446 ⎘