Jongbum LEE

City:

Suwon-si

Country:

South Korea

Published Applications:

Last publication date:

2026-02-12

Top Assignees for applications by Jongbum LEE

The entities that hold a legal rights for patent applications filed by inventor LEE Jongbum:

Jongbum LEE from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER JOINT, AND ELECTRONIC DEVICE INCLUDING SOLDER JOINT

CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE INCLUDING SAME

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME

SEMICONDUCTOR PACKAGE INCLUDING RESIN, AND ELECTRONIC DEVICE INCLUDING SAME

FLEXIBLE CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME

Electronic device including thermosetting bonding sheet

InventorID:

5715314 ⎘