AUSTIN, Texas
United States
14
2026-04-02
The entities that hold a legal rights for patent applications filed by inventor ALAM ARSALAN:
ARSALAN ALAM from AUSTIN, US has applied for patents for these inventions. The list has both pending applications and granted patents:
PROCESSES FOR MANUFACTURING WAFER-ON-WAFER DEVICES, AND SYSTEMS INCORPORATING SUCH DEVICES
#2 | 2025-10-16SYSTEMS AND METHODS FOR STACK CONSTRUCTION OF A SEMICONDUCTOR DEVICE HAVING REDISTRIBUTION LAYERS IN A SILICON CARRIER
#3 | 2025-09-18SYSTEMS AND METHODS FOR PACKAGING A SEMICONDUCTOR DEVICE
#4 | 2025-07-31INTEGRATED CIRCUIT DIE STACK WITH A BRIDGE DIE
#5 | 2025-07-31INTEGRATED CIRCUIT DIE STACK WITH A DUAL-SIDED BRIDGE DIE
#6 | 2025-07-17SYSTEMS AND METHODS FOR EMBEDDING ELECTRONIC COMPONENTS IN SUBSTRATES
#7 | 2025-05-22INTEGRATED CIRCUIT DIE STACK WITH A BRIDGE DIE
#8 | 2025-04-10CHIP PACKAGE WITH A THERMAL CARRIER
#9 | 2025-03-20HYBRID METHODS AND STRUCTURES FOR INCREASING CAPACITANCE DENSITY IN INTEGRATED PASSIVE DEVICES
#10 | 2025-03-20METHODS AND STRUCTURES FOR INCREASING CAPACITANCE DENSITY IN INTEGRATED PASSIVE DEVICES
#11 | 2024-02-08METHODS FOR CONSTRUCTING PACKAGE SUBSTRATES WITH HIGH DENSITY
#12 | 2023-06-29STACKING POWER DELIVERY DEVICE DIES
#13 | 2023-06-22ELECTRONIC DEVICE INCLUDING AN INTEGRATED CIRCUIT DIE AND A SUPPORT STRUCTURE
#14 | 2023-04-20TESTING A SEMICONDUCTOR DIE USING TEMPORARY TEST PADS APPLIED TO CONDUCTIVE PADS OF THE SEMICONDUCTOR DIE
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