Junga LEE

City:

Suwon-si

Country:

South Korea

Published Applications:

Last publication date:

2025-05-22

Top Assignees for applications by Junga LEE

The entities that hold a legal rights for patent applications filed by inventor LEE Junga:

Junga LEE from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND A BONDING DEVICE FOR MANUFACTURING A SEMICONDUCTOR PACKAGE

Solder reflow apparatus and method of manufacturing an electronic device

EPITAXIAL WAFER AND SEMICONDUCTOR MEMORY DEVICE USING THE SAME

InventorID:

5733325 ⎘