Chandler, Arizona
United States
8
2013-12-19
The entities that hold a legal rights for patent applications filed by inventor Wang Lejun:
Lejun Wang from Chandler, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Integrated circuit packaging for implantable medical devices
#2 | 2013-12-19Wafer level packages of high voltage units for implantable medical devices
#3 | 2008-06-26Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same
#4 | 2007-05-24Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material
#5 | 2007-04-03Self-aligned mechanical joint between die and substrate exposed to mixed microwave energy
#6 | 2005-09-08Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material
#7 | 2005-09-08Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same
#8 | 2005-05-31Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material
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