Tokyo
Japan
43
2025-05-22
The entities that hold a legal rights for patent applications filed by inventor Ishikawa Dai:
Dai Ishikawa from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
COPPER PASTE, WICK FORMATION METHOD, AND HEAT PIPE
#2 | 2024-12-26METAL PASTE FOR BONDING, AND BONDED BODY AND METHOD FOR PRODUCING SAME
#3 | 2024-09-12METAL PASTE FOR JOINING, JOINT, AND MANUFACTURING METHOD THEREFOR
#4 | 2024-06-06COPPER PASTE FOR FORMING SINTERED COPPER PILLARS AND METHOD FOR PRODUCING BONDED BODY
#5 | 2024-05-16COMPOSITION AND AMELIORATING AGENT HAVING INFLAMMATION REDUCING EFFECT
#6 | 2024-05-09COMPOSITION AND AMELIORATING AGENT HAVING INFLAMMATION REDUCING EFFECT
#7 | 2023-11-09Copper paste, wick formation method, and heat pipe
#8 | 2022-11-24COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND JOINED BODY
#9 | 2022-02-10Formation of SiN thin films
#10 | 2021-11-11Member connection method
#11 | 2021-06-10SUBSTRATE PROCESSING APPARATUS, BEVEL MASK AND SUBSTRATE PROCESSING METHOD
#12 | 2021-05-13Copper paste for pressureless bonding, bonded body and semiconductor device
#13 | 2020-10-29Method for producing joined body, and joining material
#14 | 2020-10-08Method for forming silicon nitride film selectively on top/bottom portions
#15 | 2020-09-17Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion module
#16 | 2020-09-17Reaction chamber passivation and selective deposition of metallic films
#17 | 2020-06-04Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device
#18 | 2020-04-30Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device
#19 | 2020-04-16Method for etching a carbon-containing feature
#20 | 2020-04-09Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device
#21 | 2020-03-05Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device
#22 | 2019-12-12Formation of SiN thin films
#23 | 2019-11-21Copper paste for pressureless bonding, bonded body and semiconductor device
#24 | 2019-08-22Method of spacer-defined direct patterning in semiconductor fabrication
#25 | 2019-05-16Method of selectively depositing a capping layer structure on a semiconductor device structure
#26 | 2019-02-21Method for forming silicon nitride film selectively on top surface
#27 | 2019-02-21Reaction chamber passivation and selective deposition of metallic films
#28 | 2018-11-29Assembly and semiconductor device
#29 | 2018-09-06Copper paste for joining, method for producing joined body, and method for producing semiconductor device
#30 | 2018-03-22Reaction chamber passivation and selective deposition of metallic films
#31 | 2017-12-14Selective deposition of metallic films
#32 | 2017-11-02Method for forming spacers using silicon nitride film for spacer-defined multiple patterning
#33 | 2017-10-31Selective deposition of metallic films
#34 | 2017-10-31Reaction chamber passivation and selective deposition of metallic films
#35 | 2017-08-31Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
#36 | 2017-08-24Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
#37 | 2017-03-02Formation of SiN thin films
#38 | 2016-03-31Method for hydrophobization of surface of silicon-containing film by ALD
#39 | 2015-04-30Method for treating SiOCH film with hydrogen plasma
#40 | 2015-02-26Method for forming SiOCH film using organoaminosilane annealing
#41 | 2014-04-10Heating/cooling pedestal for semiconductor-processing apparatus
#42 | 2014-02-13Method for supplying gas with flow rate gradient over substrate
#43 | 2013-12-19Method for repairing damage of dielectric film by cyclic processes
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