Chan Lam Cha

City:

Jasin

Country:

Malaysia

Published Applications:

Last publication date:

2025-12-18

Top Assignees for applications by Chan Lam Cha

The entities that hold a legal rights for patent applications filed by inventor Cha Chan Lam:

Chan Lam Cha from Jasin, MY has applied for patents for these inventions. The list has both pending applications and granted patents:

METHOD OF FORMING AN ELECTRICAL CONNECTION AND ELECTRICAL CONNECTION

Methods for Manufacturing Semiconductor Packages

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

MOLDED POWER DIE PACKAGE WITH VERTICAL INTERCONNECT

Chip package and method of forming a chip package

InventorID:

5779523 ⎘