Newark, California
United States
6
2013-12-26
The entities that hold a legal rights for patent applications filed by inventor Kong Bob:
Bob Kong from Newark, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Electroless deposition of platinum on copper
#2 | 2012-12-27Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processing
#3 | 2012-11-22Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processing
#4 | 2012-04-19Electroless deposition of platinum on copper
#5 | 2010-08-12Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processing
#6 | 2010-03-04Electroless Deposition of Platinum on Copper
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