Won Seok LEE

City:

Daegu

Country:

South Korea

Published Applications:

Last publication date:

2017-10-26

Top Assignees for applications by Won Seok LEE

The entities that hold a legal rights for patent applications filed by inventor LEE Won Seok:

Won Seok LEE from Daegu, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

Ultrasonic transducer having flexible printed circuit board with thick metal layer and manufacturing method thereof

Jig, manufacturing method thereof, and flip chip bonding method for chips of ultrasound probe using jig

Jig, manufacturing method thereof, and flip chip bonding method for chips of ultrasound probe using jig

InventorID:

582567 ⎘