Bayan Lepas
Malaysia
6
2018-05-24
The entities that hold a legal rights for patent applications filed by inventor Ooi Kooi Chi:
Kooi Chi Ooi from Bayan Lepas, MY has applied for patents for these inventions. The list has both pending applications and granted patents:
HIGH DENSITY SECOND LEVEL INTERCONNECTION FOR BUMPLESS BUILD UP LAYER (BBUL) PACKAGING TECHNOLOGY
#2 | 2017-01-19Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same
#3 | 2016-01-07Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same
#4 | 2014-04-03High density second level interconnection for bumpless build up layer (BBUL) packaging technology
#5 | 2013-12-26Method to enable controlled side chip interconnection for 3D integrated packaging system
#6 | 2008-12-25VERTICAL CONTROLLED SIDE CHIP CONNECTION FOR 3D PROCESSOR PACKAGE
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