Shinya ARUGA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2025-12-18

Top Assignees for applications by Shinya ARUGA

The entities that hold a legal rights for patent applications filed by inventor ARUGA Shinya:

Shinya ARUGA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

EXPANSION METHOD AND EXPANSION APPARATUS

METHOD AND APPARATUS FOR DIVIDING WAFER

BREAKING METHOD

DIVIDING APPARATUS

InventorID:

5841322 ⎘