Riesa SN
Germany
6
2023-10-05
The entities that hold a legal rights for patent applications filed by inventor Proschwitz Jan:
Jan Proschwitz from Riesa SN, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT AND HEAT PATH
#2 | 2023-09-21INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT
#3 | 2023-09-21PACKAGING ARCHITECTURE WITH THERMALLY CONDUCTIVE INTEGRATED CIRCUIT BRIDGE
#4 | 2023-09-21MICROELECTRONIC ASSEMBLIES INCLUDING NANOWIRE AND SOLDER INTERCONNECTS
#5 | 2023-09-07STACKED DIE PACKAGING ARCHITECTURE WITH CONDUCTIVE VIAS ON INTERPOSER
#6 | 2023-09-07PACKAGING ARCHITECTURE WITH ACTIVE COOLING
5844879 ⎘