Munich
Germany
15
2025-06-26
The entities that hold a legal rights for patent applications filed by inventor Mesa Eduardo De:
Eduardo De Mesa from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Active Cooling for Heterogenous Packages
#2 | 2025-06-26STIFFENER ASSEMBLY
#3 | 2025-04-03DIE PLACEMENT WITHIN A FORMED CAVITY ON A REDISTRIBUTION LAYER
#4 | 2023-10-05THIN CLIENT FORM FACTOR ASSEMBLY
#5 | 2023-10-05THREE-DIMENSIONAL STACK COOLING WINGS
#6 | 2023-10-05INTERPOSERS FOR SEMICONDUCTOR DEVICES
#7 | 2023-10-05GLASS BRIDGE FOR CONNECTING DIES
#8 | 2023-10-05GLASS CORE SUBSTRATE PRINTED CIRCUIT BOARD FOR WARPAGE REDUCTION
#9 | 2023-10-05HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS
#10 | 2023-09-21PACKAGING ARCHITECTURE WITH THERMALLY CONDUCTIVE INTEGRATED CIRCUIT BRIDGE
#11 | 2023-09-21MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS
#12 | 2023-09-21MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS
#13 | 2023-09-21MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS
#14 | 2023-09-07STACKED DIE PACKAGING ARCHITECTURE WITH CONDUCTIVE VIAS ON INTERPOSER
#15 | 2023-09-07PACKAGING ARCHITECTURE WITH ACTIVE COOLING
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