Phoenix, Arizona
United States
30
2026-06-18
The entities that hold a legal rights for patent applications filed by inventor Kaviani Shayan:
Shayan Kaviani from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:
THROUGH GLASS VIAS WITH MULTILAYERED ORGANIC/INORGANIC LINER FOR INTEGRATED CIRCUIT DEVICE PACKAGES
#2 | 2026-05-07MICROELECTRONIC ASSEMBLIES INCLUDING MULTIPLE LINERS IN THROUGH-GLASS VIAS
#3 | 2026-03-26SEMICONDUCTOR CORE LAYER INCLUDING GLASS SHEET HAVING EDGE PROTECTION STRUCTURE AND METHOD OF MAKING SAME
#4 | 2026-03-19INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS-CORE SUBSTRATE
#5 | 2026-01-01METHODS AND SYSTEMS FOR FORMING INTEGRATED CIRCUIT PACKAGES COMPRISING GLASS LAYERS
#6 | 2026-01-01GLASS CORE EDGE TREATMENTS FOR HYBRID PANELS IN DEVICE PACKAGING
#7 | 2026-01-01HYBRID GLASS AND ORGANIC SUBSTRATES
#8 | 2025-10-02SUBSTRATE WITH COMPONENT EMBEDDED IN A BLIND CAVITY
#9 | 2025-09-04HIGH ASPECT RATIO VIAS WITH LOW STRESS IN INTEGRATED CIRCUIT PACKAGES
#10 | 2025-07-03TECHNOLOGIES FOR A STACK OF COMPONENTS EMBEDDED IN A SUBSTRATE CORE
#11 | 2025-07-03METHODS AND APPARATUS FOR MOUNTING SEMICONDUCTOR DEVICES IN CAVITIES
#12 | 2025-07-03EMBEDDED DEEP TRENCH CAPACITORS IN INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES
#13 | 2025-07-03LIQUID-BASED METHOD FOR EMBEDDING COMPONENTS IN THICK SUBSTRATES
#14 | 2025-06-26PASSIVATION BOUNDARY DEFECTS FOR REDUCED LEAKAGE CURRENT CAPACITOR DIELECTRIC MATERIALS
#15 | 2025-06-26MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES
#16 | 2025-06-05MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATION IN GLASS CORES
#17 | 2025-04-24POROUS LINERS FOR THROUGH-GLASS VIAS AND ASSOCIATED METHODS
#18 | 2025-03-27ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES
#19 | 2025-01-09HYBRID CORES INCLUDING ADHESIVE PROMOTION LAYERS AND RELATED METHODS
#20 | 2025-01-02CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS
#21 | 2025-01-02SEMICONDUCTOR LAYER WITH DRY DEPOSITION LAYER
#22 | 2024-07-04SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS
#23 | 2024-06-27THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES
#24 | 2024-06-27THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA
#25 | 2024-06-06POLYMERIC FILMS AS AN ADHESIVE PROMOTION/BUFFER LAYER AT GLASS-DIELECTRIC OR METAL-DIELECTRIC INTERFACES
#26 | 2024-04-04INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION
#27 | 2024-04-04EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS
#28 | 2024-03-28METHODS AND APPARATUS UTILIZING CONJUGATED POLYMERS IN INTEGRATED CIRCUIT PACKAGES WITH GLASS SUBSTRATES
#29 | 2024-03-21THIN FILM CAPACITORS
#30 | 2023-09-21MICROELECTRONIC STRUCTURE INCLUDING CONDUCTIVE POLYMER IN TRENCHES OF A CORE SUBSTRATE, AND METHOD OF MAKING SAME
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