Stefan Reif

City:

Munich

Country:

Germany

Published Applications:

Last publication date:

2025-06-26

Top Assignees for applications by Stefan Reif

The entities that hold a legal rights for patent applications filed by inventor Reif Stefan:

Stefan Reif from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Active Cooling for Heterogenous Packages

STIFFENER ASSEMBLY

SUPPORT STRUCTURES FOR SEMICONDUCTOR SUBSTRATES

ASSEMBLY AND METHOD FOR PREVENTING WARPAGE IN A SEMICONDUCTOR PACKAGE

SUBSTRATE FOR IMPROVED HEAT DISSIPATION AND METHOD

MICROELECTRONIC ASSEMBLIES INCLUDING NANOWIRE AND SOLDER INTERCONNECTS

InventorID:

5857733 ⎘