Hamburg
Germany
16
2026-04-02
The entities that hold a legal rights for patent applications filed by inventor Böttcher Tim:
Tim Böttcher from Hamburg, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
CLIP-BONDED SEMICONDUCTOR PACKAGE AND CORRESPONDING METHOD OF MANUFACTURING SUCH A SEMICONDUCTOR PACKAGE
#2 | 2026-01-01SEMICONDUCTOR DEVICE WITH PLATED CLIP AND FLIP-CHIP INTERCONNECT ON LEADFRAME
#3 | 2025-06-26SUPPRESSION OF AUTO-DOPING DURING EPITAXIAL GROWTH OF EPITAXY LAYER IN A SEMICONDUCTOR DEVICE
#4 | 2025-06-26SEMICONDUCTOR POWER DEVICE WITH TERMINATION RINGS
#5 | 2025-03-27RECESSED REGIONS OF A JUNCTION TERMINATION EXTENSION FOR SEMICONDUCTOR DEVICES
#6 | 2025-03-27TOP SURFACE OF A JUNCTION TERMINATION EXTENSION FOR SEMICONDUCTOR DEVICES
#7 | 2025-02-27Semiconductor Device Having an Improved Termination Area Using a Plurality of Laterally Spaced Apart First Regions, as well as a Corresponding Method and Power Device.
#8 | 2024-11-07METHOD OF IMPROVING PACKAGE CREEPAGE DISTANCE
#9 | 2024-10-31Control of the Forward and Reverse Characteristics of Vertically Oriented Semiconductor Devices
#10 | 2024-10-31Schottky Barrier Control in Vertically Oriented Semiconductor Devices As Well As a Corresponding Power Device
#11 | 2024-04-11Semiconductor Package Assembly
#12 | 2024-04-11Method of Manufacturing a Semiconductor Package, Such Semiconductor Package as well as an Electronic System Comprising a PCB Element and at Least Such Semiconductor Package
#13 | 2024-03-28Method of Improving Package Creepage Distance
#14 | 2024-03-21SEMICONDUCTOR POWER DEVICE WITH IMPROVED RUGGEDNESS
#15 | 2024-02-29VERTICAL SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
#16 | 2023-09-28VERTICAL ORIENTED SEMICONDUCTOR DEVICE HAVING A REDUCED LATERAL FIELD TERMINATION DISTANCE, AS WELL AS A CORRESPONDING METHOD
5864093 ⎘