Phoenix, Arizona
United States
11
2013-12-26
The entities that hold a legal rights for patent applications filed by inventor Baskaran Rajashree:
Rajashree Baskaran from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Microelectronic package having direct contact heat spreader and method of manufacturing same
#2 | 2009-03-12Semiconductor substrate with islands of diamond and resulting devices
#3 | 2008-10-02Patterned backside stress engineering for transistor performance optimization
#4 | 2008-01-03Wafer-level assembly of heat spreaders for dual IHS packages
#5 | 2007-11-01Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same
#6 | 2007-06-28Surface mounted micro-scale springs for separable interconnection of package substrate and high-speed flex-circuit
#7 | 2007-04-05Microelectronic package having direct contact heat spreader and method of manufacturing same
#8 | 2007-03-22Semiconductor substrate with islands of diamond and resulting devices
#9 | 2007-03-15Self-assembled thin film thermoelectric device
#10 | 2006-10-05Semiconductor integrated circuit (IC) packaging with carbon nanotubes (CNT) to reduce IC/package stress
#11 | 2006-03-30Patterned backside stress engineering for transistor performance optimization
586991 ⎘