Suwon-si
South Korea
63
2026-06-04
The entities that hold a legal rights for patent applications filed by inventor Kang Junghoon:
Junghoon Kang from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR PACKAGE INCLUDING OPTICAL INTEGRATED CIRCUIT CHIP
#2 | 2026-06-04SEMICONDUCTOR PACKAGE
#3 | 2026-06-04SEMICONDUCTOR PACKAGE
#4 | 2026-06-04SEMICONDUCTOR PACKAGE
#5 | 2026-05-14SEMICONDUCTOR PACKAGE INCLUDING OPTICAL DEVICE PACKAGE
#6 | 2026-04-30SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#7 | 2026-04-30GLASS SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING GLASS SUBSTRATE, AND METHOD FOR MANUFACTURING THE SAME
#8 | 2026-04-16SEMICONDUCTOR PACKAGE
#9 | 2026-04-16SEMICONDUCTOR PACKAGE
#10 | 2026-04-09SEMICONDUCTOR PACKAGE
#11 | 2026-04-02SEMICONDUCTOR PACKAGE
#12 | 2026-03-26SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#13 | 2026-03-19SEMICONDUCTOR PACKAGE
#14 | 2026-03-19SEMICONDUCTOR PACKAGE
#15 | 2026-02-26SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#16 | 2026-02-26SEMICONDUCTOR PACKAGE
#17 | 2026-02-05SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#18 | 2026-02-05SEMICONDUCTOR PACKAGE
#19 | 2026-01-22SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#20 | 2026-01-22SEMICONDUCTOR PACKAGE
#21 | 2026-01-08SEMICONDUCTOR PACKAGE
#22 | 2026-01-01SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#23 | 2025-12-25SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
#24 | 2025-12-11SEMICONDUCTOR PACKAGE
#25 | 2025-12-04SEMICONDUCTOR PACKAGE INCLUDING MULTI-PART CONNECTION
#26 | 2025-10-30SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE AND A LASER MARK
#27 | 2025-10-30SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#28 | 2025-10-30SEMICONDUCTOR PACKAGE
#29 | 2025-10-02GLASS SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING GLASS SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
#30 | 2025-10-02SEMICONDUCTOR PACKAGE
#31 | 2025-09-04SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#32 | 2025-08-07REDISTRIBUTION SUBSTRATE, MANUFACTURING METHOD OF THE SAME, AND A SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#33 | 2025-08-07REDISTRIBUTION SUBSTRATE, MANUFACTURING METHOD OF THE SAME, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#34 | 2025-07-03SEMICONDUCTOR PACKAGE
#35 | 2025-06-05SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#36 | 2025-05-22SEMICONDUCTOR PACKAGE INCLUDING A SOLDER BALL
#37 | 2025-05-15SEMICONDUCTOR PACKAGE INCLUDING A CONDUCTIVE PILLAR
#38 | 2025-05-15SEMICONDUCTOR PACKAGE
#39 | 2025-05-08SEMICONDUCTOR PACKAGE
#40 | 2025-05-08SEMICONDUCTOR PACKAGE
#41 | 2025-04-17SEMICONDUCTOR PACKAGE
#42 | 2025-04-17SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC CHIP
#43 | 2025-04-17SEMICONDUCTOR PACKAGE WITH PHOTONIC CHIP
#44 | 2025-04-10SEMICONDUCTOR PACKAGE WITH PHOTONICS CHIP
#45 | 2025-03-27SEMICONDUCTOR PACKAGE
#46 | 2025-03-27SEMICONDUCTOR PACKAGE
#47 | 2025-03-27SEMICONDUCTOR PACKAGE
#48 | 2025-03-20SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC INTEGRATED CIRCUIT CHIP
#49 | 2025-03-13SEMICONDUCTOR PACKAGE
#50 | 2025-03-06SEMICONDUCTOR PACKAGES
#51 | 2025-03-06SEMICONDUCTOR PACKAGES
#52 | 2025-02-20SEMICONDUCTOR PACKAGE
#53 | 2025-01-30SEMICONDUCTOR PACKAGE
#54 | 2025-01-30SEMICONDUCTOR PACKAGE
#55 | 2025-01-16SEMICONDUCTOR PACKAGE WITH GLASS CORE SUBSTRATE AND METHOD OF FABRICATING THE SAME
#56 | 2025-01-09SEMICONDUCTOR PACKAGE
#57 | 2024-12-26METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
#58 | 2024-09-26SEMICONDUCTOR PACKAGE
#59 | 2024-07-11SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#60 | 2024-06-27SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
#61 | 2024-06-20IMAGE SENSOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#62 | 2024-04-25SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#63 | 2023-10-12SEMICONDUCTOR PACKAGE
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