Munich
Germany
39
2022-06-23
The entities that hold a legal rights for patent applications filed by inventor Strack Helmut:
Helmut Strack from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor device having a silicon carbide drift zone over a silicon carbide field stop zone
#2 | 2021-01-14Method of manufacturing a semiconductor device and semiconductor device
#3 | 2018-03-01Method for producing a doped semiconductor layer
#4 | 2016-11-24Methods for manufacturing semiconductor devices
#5 | 2015-12-31Field effect semiconductor component and methods for operating and producing it
#6 | 2015-07-02Semiconductor body with a buried material layer and method
#7 | 2015-04-21Method of manufacturing a semiconductor device including proton irradiation and semiconductor device including charge compensation structure
#8 | 2014-08-21Method for forming a power semiconductor device
#9 | 2014-05-22Method for manufacturing a semiconductor device
#10 | 2014-03-13Method for fabricating a trench structure, and a semiconductor arrangement comprising a trench structure
#11 | 2014-03-06Method for producing a semiconductor layer
#12 | 2014-01-16Semiconductor body with a buried material layer and method
#13 | 2014-01-02Semiconductor Device and Method for Producing a Doped Semiconductor Layer
#14 | 2013-02-28Method for producing a semiconductor
#15 | 2012-11-15Power semiconductor device and a method for forming a semiconductor device
#16 | 2012-09-06SEMICONDUCTOR BODY WITH A BURIED MATERIAL LAYER
#17 | 2012-01-26Normally-Off Field Effect Transistor, a Manufacturing Method Therefor and a Method for Programming a Power Field Effect Transistor
#18 | 2011-06-23SEMICONDUCTOR BODY WITH A BURIED MATERIAL LAYER AND METHOD
#19 | 2011-06-23SEMICONDUCTOR COMPONENT HAVING AN OXIDE LAYER
#20 | 2011-04-07Wafer and a method for manufacturing a wafer
#21 | 2010-11-25Power semiconductor device and method for its production
#22 | 2010-10-21Panel, semiconductor device and method for the production thereof
#23 | 2010-10-21Capacitor structure in trench structures of semiconductor devices and semiconductor devices comprising capacitor structures of this type and methods for fabricating the same
#24 | 2010-08-19Method for producing a semiconductor
#25 | 2009-12-10Method for producing a semiconductor layer
#26 | 2009-10-22Semiconductor module
#27 | 2009-09-17Semiconductor module
#28 | 2009-05-21Power semiconductor component with charge compensation structure and method for the fabrication thereof
#29 | 2009-04-02Wafer and method for producing a wafer
#30 | 2009-04-02Wafer and a method for manufacturing a wafer
#31 | 2008-08-21Semiconductor component with vertical structures having a high aspect ratio and method
#32 | 2008-08-14Panel, semiconductor device and method for the production thereof
#33 | 2008-01-03Semiconductor device with a field stop zone
#34 | 2007-12-13Power semiconductor device connected in distinct layers of plastic
#35 | 2007-06-28Semiconductor wafer substrate for power semiconductor components and method for producing the same
#36 | 2007-02-01Semiconductor wafer with a wiring structure, a semiconductor component, and methods for their production
#37 | 2006-01-19Method for fabricating a buried metallic layer in a semiconductor body and semiconductor component having a buried metallic layer
#38 | 2005-03-22High voltage resistant edge structure for semiconductor components
#39 | 2005-02-08Method of assembling a semiconductor device package
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