Seongnam-si
South Korea
21
2020-09-24
The entities that hold a legal rights for patent applications filed by inventor Ha Tae-Won:
Tae-Won Ha from Seongnam-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor device including a first fin active region, a second fin active region and a field region
#2 | 2019-05-02Semiconductor device
#3 | 2019-03-21Semiconductor device and method for fabricating the same
#4 | 2018-12-20Semiconductor device including a first fin active region and a second fin active region
#5 | 2018-07-26Semiconductor device
#6 | 2017-09-28Method for fabricating a semiconductor device having a first fin active pattern and a second fin active pattern
#7 | 2017-07-27Semiconductor device with conductive pattern on insulating line pattern on spacer on field insulating film in trench between fin patterns
#8 | 2017-04-27SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#9 | 2017-04-20Semiconductor device and method for fabricating the same
#10 | 2016-06-09Semiconductor device having a substrate including a first active region and a second active region
#11 | 2016-05-05Semiconductor device and method for fabricating the same
#12 | 2016-04-21High-integration semiconductor device and method for fabricating the same
#13 | 2016-03-31Semiconductor device and method for fabricating the same
#14 | 2016-02-11Semiconductor device and method for fabricating the same
#15 | 2015-12-10Integrated Circuit Device with Metal Gates Including Diffusion Barrier Layers and Fabricating Methods Thereof
#16 | 2015-12-10Method for fabricating semiconductor device including replacement process of forming at least one metal gate structure
#17 | 2015-07-30High-integration semiconductor device and method for fabricating the same
#18 | 2015-01-15High integration semiconductor device and method for fabricating the same
#19 | 2014-12-18METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
#20 | 2014-08-28Semiconductor device and fabricating method thereof
#21 | 2014-01-02Integrated circuit device with metal gates including diffusion barrier layers and fabricating methods thereof
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