Saikumar Jayaraman

WAFER LEVEL MULTI FORM FACTOR DIE SINGULATION

SELF-LOCKING OPTICAL CONNECTOR FOR PHOTONIC INTEGRATED CIRCUITS

GRADED INDEX (GRIN) LENS EXPANDED BEAM (EB) COUPLER FOR DETACHABLE FIBER ARRAY UNIT (FAU)

EXPANDED BEAM FIBER ARRAY UNIT USING SPLICED PHOTONIC CRYSTAL AND MODE FIELD ADAPTER FIBERS

HEAT SPREADERS FOR OPTICAL FIBER ARRAY INTERCONNECTS

SINTERABLE NANOPARTICLES FOR ORGANIC-FREE OPTICAL ADHESIVES

FIBER ARRAY UNIT FOR HIGH DENSITY OPTICAL FIBER CONNECTIONS TO PHOTONIC INTEGRATED CIRCUIT SHORELINES

PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING AN ON-PACKAGE EXPANDED BEAM CONNECTOR FOR DETACHABLE FIBER ARRAY

PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING AN ON-PACKAGE EXPANDED BEAM CONNECTOR FOR DETACHABLE FIBER ARRAY

PACKAGE WITH OPTICAL CONNECTOR

On-Package Self-Aligning Expanded-Beam Connector

EXPANDED BEAM OPTICAL COUPLING WITH A BALL LENS

TAPERED OPTICAL FEATURES FOR OPTICAL FIBER CONNECTIONS

PASSIVE LENS ARRAY STRUCTURE FOR PHOTONIC INTEGRATED CIRCUIT (PIC)

ADHESIVE-FREE EXPANDED BEAM FIBER ARRAY UNIT (FAU)

POLYETHYLENE OXIDE-BASED OPTICAL ADHESIVE

TECHNOLOGIES FOR FIBER ARRAY UNIT LID DESIGNS

PHOTONIC INTEGRATED CIRCUIT WITHIN A CAVITY OF INTERPOSER

METHODS AND TOOLS FOR PREVENTING THE COUNTERFEITING AND TAMPERING OF SEMICONDUCTOR DEVICES

Systems and methods for device authentication in supply chain

Architecture and processes to enable high capacity memory packages through memory die stacking

Thermally-optimized tunable stack in cavity package-on-package

Pillar based socket

FORMING A STRESS COMPENSATION LAYER AND STRUCTURES FORMED THEREBY

Integrated circuit package stack

DRY-REMOVABLE PROTECTIVE COATINGS

Integrated WLUF and SOD process

Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby

Dry-removable protective coatings

Solder-on-die using water-soluble resist system and method

Polymer matrices for polymer solder hybrid materials

Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby

Thermoset polymides for microelectronic applications

Integrated WLUF and SOD process

Method of fabricating a capillary-flow underfill compositions

Polymer matrices for polymer solder hybrid materials

Polymerized cycloolefins using transition metal catalyst and end products thereof

Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly

Thermoset polyimides for microelectronic applications

Low temperature bumping process

Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly

Polycyclic polymers containing pendant ion conducting moieties

Directly photodefinable polymer compositions and methods thereof

Capillary-flow underfill compositions, packages containing same, and systems containing same

Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same

Underfill and mold compounds including siloxane-based aromatic diamines

Thermal interface material and electronic assembly having such a thermal interface material

Phase change material containing fusible particles as thermally conductive filler

Thermoset polyimides for microelectronic applications

Polymer matrices for polymer solder hybrid materials

Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same

Polymer matrices for polymer solder hybrid materials

Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same

Wafer-level processing of chip-packaging compositions including bis-maleimides

Chip package dielectric sheet for body-biasing

Chip-packaging compositions including bis-maleimides, packages made therewith, and methods of assembling same

Low temperature bumping process

Flip-chip system and method of making same

Underfill and mold compounds including siloxane-based aromatic diamines

Photosensitive compositions based on polycyclic polymers

Anhydride polymers for use as curing agents in epoxy resin-based underfill material

Forming a stress compensation layer and structures formed thereby

Anhydride polymers for use as curing agents in epoxy resin-based underfill material

Underfill of resin and sulfonic acid-releasing thermally cleavable compound

Photosensitive compositions based on polycyclic polymers

Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same

Underfill and mold compounds including siloxane-based aromatic diamines

Thermoelectric cooling for microelectronic packages and dice

Jet-dispensed stress relief layer in contact arrays, and processes of making same

Stress-relief layer and stress-compensation collar in contact arrays, and processes of making same

Microelectronic packaging and methods for thermally protecting package interconnects and components

Phase change material containing fusible particles as thermally conductive filler

Directly photodefinable polymer compositions and methods thereof

Phase change material containing fusible particles as thermally conductive filler

Silicone-based cyanate-ester cross-linkable die attach adhesive

Curing processes for substrate imprinting, structures made thereby, and polymers used therefor

Microelectronic packaging and methods for thermally protecting package interconnects and components

Polymerized cycloolefins using transition metal catalyst and end products thereof

Stress compensation layer systems for improved second level solder joint reliability

Polycyclic polymers containing pendant ion conducting moieties

Silicone-based cyanate-ester cross-linkable die attach adhesive