Robert Nickerson

ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES

ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES

SOLDER GRID ARRAY FOR ATTACHMENT OF A DIE PACKAGE

ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES

ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES

Ultra-thin, hyper-density semiconductor packages

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON-PACKAGE STRUCTURES

Micro-trenching mold interface in a pop package

SUBSTRATE ARCHITECTURE FOR SOLDER JOINT RELIABILTY IN MICROELECTRONIC PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME

Methods of forming trenches in packages structures and structures formed thereby

Methods for solder for through-mold interconnect

Tall solders for through-mold interconnect

Package substrates with multiple dice

Package substrates with multiple dice

Processes of making pad-less interconnect for electrical coreless substrate

BOND FINGER ON VIA SUBSTRATE, PROCESS OF MAKING SAME, PACKAGE MADE THEREBY, AND METHOD OF ASSEMBLING SAME

CIRCULAR WIRE-BOND PAD, PACKAGE MADE THEREWITH, AND METHOD OF ASSEMBLING SAME

Bond finger on via substrate, process of making same, package made thereby, and method of assembling same

BALL GRID ARRAY COPPER BALANCING

Ball grid array copper balancing

Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling same

In-line wire bonding on a package, and method of assembling same

Circular wire-bond pad, package made therewith, and method of assembling same

Bottom heat spreader

Method and apparatus for trace shielding and routing on a substrate