Hyun Jun Lee

City:

Suwon

Country:

South Korea

Published Applications:

Last publication date:

2015-05-28

Top Assignees for applications by Hyun Jun Lee

The entities that hold a legal rights for patent applications filed by inventor Lee Hyun Jun:

SAMSUNG ELECTRO-MECHANICS CO., LTD. 8 Suwon, South Korea
SAMSUNG ELECTRO-MECHANICS CO., LTD. 2 Gyunggi-do, South Korea
SAMSUNG ELECTRONICS CO., LTD. 1 Suwon-si, South Korea
Samsung Electro-Mechanisc Co., Ltd. 1 Suwon, South Korea

Recent patent applications by Lee Hyun Jun

Hyun Jun Lee from Suwon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-05-28

US20150147542A1

Electricity

RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD COMPRISING THE SAME

#2 | 2015-02-26

US20150057393A1

Electricity

INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRODUCTS MANUFACTURED BY USING THE SAME

#3 | 2014-05-29

US20140147639A1

Chemistry; metallurgy

Resin composition for printed circuit board, insulating film, prepreg, and printed circuit board

#4 | 2014-04-17

US20140106147A1

Performing operations; transporting

PREPREG, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD

#5 | 2014-03-20

US20140079924A1

Electricity

RESIN COMPOSITION FOR PACKAGE SUBSTRATE AND PACKAGE SUBSTRATE COMPRISING CORE LAYER AND PREPREG USING THE SAME

#6 | 2014-03-20

US20140077129A1

Electricity

Epoxy resin composition for printed circuit board, insulating film, prepreg, and multilayer printed circuit board

#7 | 2014-03-06

US20140063427A1

Chemistry; metallurgy

RESIN COMPOSITION FOR THERMAL RADIATION BOARD AND THERMAL RADIATION BOARD COMPRISING THE SAME

#8 | 2014-02-06

US20140034367A1

Electricity

EPOXY RESIN COMPOSITION FOR PRITNED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD

#9 | 2014-01-02

US20140002226A1

Electricity

INDUCTOR AND METHOD OF MANUFACTURING THE SAME

#10 | 2005-04-19

US9881767

Multi-function apparatus and method for receiving and printing electronic letter

InventorID:

593632 ⎘