Balakrishna JAYADEV

City:

Mountain View, California

Country:

United States

Published Applications:

Last publication date:

2025-05-22

Top Assignees for applications by Balakrishna JAYADEV

The entities that hold a legal rights for patent applications filed by inventor JAYADEV Balakrishna:

XILINX, INC. 3 San Jose, CA United States

Recent patent applications by JAYADEV Balakrishna

Balakrishna JAYADEV from Mountain View, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-05-22

US20250167152A1

Electricity

CHIP BUMP INTERFACE COMPATIBLE WITH DIFFERENT ORIENTATIONS AND TYPES OF DEVICES

#2 | 2024-08-29

US20240291635A1

Electricity

KEY MANAGEMENT SYSTEM

#3 | 2024-01-11

US20240014161A1

Electricity

Chip bump interface compatible with different orientations and types of devices

#4 | 2023-10-10

US17235843

Electricity

Chip bump interface compatible with different orientations and types of devices

InventorID:

5963288 ⎘