Tokyo
Japan
6
2014-01-02
The entities that hold a legal rights for patent applications filed by inventor OHTA Shinro:
Shinro OHTA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Processing end point detection method, polishing method, and polishing apparatus
#2 | 2010-01-21Processing end point detection method, polishing method, and polishing apparatus
#3 | 2007-10-11Polishing apparatus and polishing method
#4 | 2006-09-05Substrate polishing apparatus
#5 | 2006-07-25Polishing apparatus and polishing pad
#6 | 2006-04-04Polishing apparatus
596709 ⎘