Waverly, New York
United States
15
2013-01-31
The entities that hold a legal rights for patent applications filed by inventor Wilson William E.:
William E. Wilson from Waverly, US has applied for patents for these inventions. The list has both pending applications and granted patents:
THERMAL SUBSTRATE
#2 | 2012-09-27LAND GRID ARRAY (LGA) CONTACT CONNECTOR MODIFICATION
#3 | 2012-06-28Coreless layer buildup structure
#4 | 2012-06-28Coreless layer buildup structure with LGA
#5 | 2012-02-09Coreless layer buildup structure with LGA and joining layer
#6 | 2012-01-19Method of joining a semiconductor device/chip to a printed wiring board
#7 | 2011-06-02Electronic package including high density interposer and circuitized substrate assembly utilizing same
#8 | 2011-06-02Method of making high density interposer and electronic package utilizing same
#9 | 2007-11-22Apparatus for making circuitized substrates in a continuous manner
#10 | 2007-07-19Method of making circuitized substrate
#11 | 2006-10-26Apparatus and method for making circuitized substrates in a continuous manner
#12 | 2006-01-17Method of forming printed circuit card
#13 | 2006-01-12Method of forming printed circuit card
#14 | 2005-02-24Colloidal seed formation for printed circuit board metallization
#15 | 2005-02-08Colloidal seed formulation for printed circuit board metallization
59693 ⎘