Wuxi
China
8
2025-02-20
The entities that hold a legal rights for patent applications filed by inventor YANG Danfeng:
Danfeng YANG from Wuxi, CN has applied for patents for these inventions. The list has both pending applications and granted patents:
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
#2 | 2025-02-20PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
#3 | 2024-02-15PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF
#4 | 2023-12-21ANTENNA PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
#5 | 2023-08-31PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#6 | 2023-01-05Fan-out package structure and method for manufacturing the same
#7 | 2022-12-15Package structure having a plurality of chips attached to a lead frame by redistribution layer
#8 | 2022-07-14SIP package structure
5996487 ⎘