JIANGSU
China
10
2026-03-19
4
2026-02-24
These are the the leading inventors for applications assigned to JCET GROUP CO., LTD.:
JCET GROUP CO., LTD. based in JIANGSU, CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
STACKED PACKAGE STRUCTURE AND FORMING METHOD THEREOF
#2 | 2026-01-01PACKAGE STRUCTURE WITH ELECTROMAGNETIC SHIELDING FUNCTIONALITY
#3 | 2025-02-20PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#4 | 2025-01-02PACKAGE STRUCTURE WITH CAVITY AND RELATED PACKAGING METHOD
#5 | 2024-12-12PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#6 | 2024-05-23 ✅ Patent 12,562,772 granted on 2026-02-24MAGNETIC COUPLING-BASED INTER-CHIP WIRELESS COMMUNICATION INTERFACE STRUCTURE AND METHOD FOR THREE-DIMENSIONAL STACKED CHIPS
#7 | 2024-05-16 ✅ Patent 12,368,324 granted on 2025-07-22INDUCTIVE COUPLING SYSTEM AND METHOD FOR ADAPTIVE CONTROL OF POWER TRANSFER FOR WIRELESS THREE-DIMENSIONAL STACKED CHIP PACKAGE
#8 | 2024-05-16MICROMINIATURE IMAGE ACQUISITION AND PROCESSING SYSTEM PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF
#9 | 2024-04-18 ✅ Patent 12,616,057 granted on 2026-04-28DOUBLE-SIDED SIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
#10 | 2024-02-15 ✅ Patent 12,550,261 granted on 2026-02-10PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF
Also check out JCET GROUP CO., LTD.'s (JIANGSU, China) applicant profile with 10 patent applications submitted.
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