Achim Strass

City:

Munich

Country:

Germany

Published Applications:

Last publication date:

2022-04-14

Top Assignees for applications by Achim Strass

The entities that hold a legal rights for patent applications filed by inventor Strass Achim:

Achim Strass from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Fluid-cooled package having shielding layer

Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet

Package cooled with cooling fluid and comprising shielding layer

Package with partially encapsulated cooling channel for cooling an encapsulated chip

InventorID:

5999582 ⎘