Milan
Italy
21
2023-01-26
The entities that hold a legal rights for patent applications filed by inventor Shaw Mark Andrew:
Mark Andrew Shaw from Milan, IT has applied for patents for these inventions. The list has both pending applications and granted patents:
PROCESS FOR MANUFACTURING ELECTROACOUSTIC MODULES
#2 | 2021-12-09Opto-mechanical transducer apparatus and corresponding method
#3 | 2021-09-23Electro-optical system with an electrical integrated circuit over an optical integrated circuit
#4 | 2020-10-01Photonic devices and methods for formation thereof
#5 | 2019-12-05Method of producing a device for adiabatic coupling between waveguide arrays, corresponding device, and system
#6 | 2019-11-07Method for forming an electro-optical system
#7 | 2019-03-21Method of producing optical waveguides, corresponding system and device
#8 | 2018-10-18Optoelectronic device having improved optical coupling
#9 | 2018-09-27Optical waveguide, corresponding coupling arrangement, apparatus and method
#10 | 2018-04-26Optical coupling system, corresponding device and method
#11 | 2017-02-09Electro-optic device with dichroic mirror and related methods
#12 | 2016-12-01Electro-optic device with dichroic mirror and related methods
#13 | 2014-12-04Optoelectronic device having improved optical coupling
#14 | 2014-10-23Electronic assembly for mounting on electronic board
#15 | 2014-10-02Method of packaging a MEMS transducer device and packaged MEMS transducer device
#16 | 2014-01-16Encapsulated micro-electro-mechanical device, in particular a MEMS acoustic transducer
#17 | 2012-05-31Encapsulated photomultiplier device of semiconductor material, for use, for example, in machines for performing positron-emission tomography
#18 | 2011-11-10Encapsulated micro-electro-mechanical device, in particular a MEMS acoustic transducer
#19 | 2010-11-25Manufacturing method of an electronic device including overmolded MEMS devices
#20 | 2008-06-05Semiconductor package substrate and methods for forming same, in particular for MEMS devices
#21 | 2008-01-17Assembly of an integrated device enabling a facilitated fluidic connection to regions of the device
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