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Inventor profile of:

Yuji Mimura

City:

Koshi

Country:

Japan

Published Applications:

Last publication date:

2024-07-11

Top Assignees for applications by Yuji Mimura

The entities that hold a legal rights for patent applications filed by inventor Mimura Yuji:

TOKYO ELECTRON LIMITED 11 Tokyo, Japan

Recent patent applications by Mimura Yuji

Yuji Mimura from Koshi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-07-11

US20240234363A1

Electricity

BONDING LAYER AND PROCESS

#2 | 2024-03-07

US20240079222A1

Electricity

SURFACE MODIFYING APPARATUS AND BONDING STRENGTH DETERMINATION METHOD

#3 | 2023-02-23

US20230055853A1

Performing operations; transporting

Separating method, separating apparatus, and separating system

#4 | 2022-12-29

US20220415673A1

Electricity

BONDING SYSTEM AND INSPECTION METHOD OF INSPECTING COMBINED SUBSTRATE

#5 | 2022-12-01

US20220384386A1

Electricity

BONDING SYSTEM AND SURFACE MODIFICATION METHOD

#6 | 2022-11-03

US20220351987A1

Electricity

Bonding method for cleaning non-bonding surface of substrate

#7 | 2021-08-12

US20210249287A1

Electricity

Measuring method and measuring device

#8 | 2020-10-29

US20200343092A1

Electricity

Method and structure for low density silicon oxide for fusion bonding and debonding

#9 | 2020-09-17

US20200294824A1

Electricity

Bonding system with cleaning apparatus for cleaning non-bonding surface of substrate

#10 | 2016-06-02

US20160155721A1

Electricity

Bonding method, storage medium, bonding apparatus and bonding system

#11 | 2015-05-14

US20150128858A1

Performing operations; transporting

Coating apparatus

InventorID:

6037685 ⎘