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Inventor profile of:

Jun Ogawa

City:

Nirasaki

Country:

Japan

Published Applications:

Last publication date:

2021-04-01

Top Assignees for applications by Jun Ogawa

The entities that hold a legal rights for patent applications filed by inventor Ogawa Jun:

TOKYO ELECTRON LIMITED 25 Tokyo, Japan

Recent patent applications by Ogawa Jun

Jun Ogawa from Nirasaki, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-04-01

US20210095375A1

Chemistry; metallurgy

Film forming apparatus and method of operating film forming apparatus

#2 | 2021-03-04

US20210066067A1

Electricity

Film forming apparatus and film forming method

#3 | 2021-02-25

US20210057207A1

Electricity

Film forming method and film forming apparatus

#4 | 2021-02-25

US20210054502A1

Chemistry; metallurgy

Film forming method and film forming apparatus

#5 | 2020-09-17

US20200294787A1

Electricity

Film forming method and film forming apparatus

#6 | 2019-05-02

US20190127849A1

Chemistry; metallurgy

Film forming apparatus and operation method of film forming apparatus

#7 | 2018-12-20

US20180366315A1

Electricity

Film forming method, film forming apparatus, and storage medium

#8 | 2018-12-13

US20180355479A1

Chemistry; metallurgy

Film forming apparatus, method of cleaning film forming apparatus, and storage medium

#9 | 2018-05-24

US20180142350A1

Chemistry; metallurgy

Method of manufacturing semiconductor device and apparatus of manufacturing semiconductor device

#10 | 2018-02-08

US20180037992A1

Chemistry; metallurgy

Silicon nitride film forming method and silicon nitride film forming apparatus

#11 | 2017-09-28

US20170278698A1

Electricity

Semiconductor device manufacturing method and semiconductor device manufacturing system

#12 | 2017-09-21

US20170271143A1

Electricity

Film forming method and film forming apparatus

#13 | 2017-08-03

US20170221703A1

Electricity

Film forming method and film forming apparatus

#14 | 2017-06-29

US20170186606A1

Electricity

Film forming method and film forming apparatus

#15 | 2015-08-13

US20150228473A1

Electricity

Method and apparatus for forming metal oxide film

#16 | 2015-04-23

US20150107517A1

Chemistry; metallurgy

Plasma processing apparatus

#17 | 2011-06-23

US20110151679A1

Chemistry; metallurgy

Film formation method for forming silicon-containing insulating film

#18 | 2010-04-01

US20100081094A1

Electricity

Mask pattern forming method, fine pattern forming method, and film deposition apparatus

#19 | 2009-08-13

US20090203227A1

Chemistry; metallurgy

Film formation method and apparatus for forming silicon-containing insulating film

#20 | 2008-05-08

US20080107824A1

Chemistry; metallurgy

Film formation method and apparatus for semiconductor process

#21 | 2008-04-24

US20080095678A1

Electricity

Oxidation method providing parallel gas flow over substrates in a semiconductor process

#22 | 2008-04-03

US20080081104A1

Chemistry; metallurgy

Film formation method and apparatus for forming silicon oxide film

#23 | 2008-03-06

US20080057199A1

Chemistry; metallurgy

Oxidation method and apparatus for semiconductor process

#24 | 2007-02-08

US20070032047A1

Chemistry; metallurgy

Method and apparatus for forming silicon-containing insulating film

#25 | 2006-02-16

US20060032443A1

Chemistry; metallurgy

Film formation method and apparatus for semiconductor process for forming a silicon nitride film

InventorID:

6066493 ⎘