Muenchen
Germany
15
2025-01-23
The entities that hold a legal rights for patent applications filed by inventor Seidel Uwe:
Uwe Seidel from Muenchen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Method of Manufacturing a Package Having an Electronic Component and an Encapsulant Encapsulating a Dielectric Layer and a Semiconductor Die of the Electronic Component
#2 | 2023-06-15Package having an electronic component and an encapsulant encapsulating a dielectric layer and a semiconductor die of the electronic component
#3 | 2022-04-14Methods and devices related to radio frequency devices
#4 | 2021-10-28Electronic component with semiconductor die having a low ohmic portion with an active area and a high ohmic portion on a dielectric layer
#5 | 2021-02-11Methods and devices related to radio frequency devices
#6 | 2015-01-15Semiconductor structure and method for making same
#7 | 2014-05-08Semiconductor device comprising a fuse structure and a method for manufacturing such semiconductor device
#8 | 2013-12-12Shielding device
#9 | 2013-10-10Through substrate via semiconductor components and methods of formation thereof
#10 | 2013-01-31Semiconductor device comprising a fuse structure and a method for manufacturing such semiconductor device
#11 | 2011-10-27Shielding device
#12 | 2011-03-31Method for making conductive interconnects
#13 | 2010-09-16Through substrate via semiconductor components
#14 | 2009-12-10Through substrate via semiconductor components
#15 | 2007-11-15Shielding device
61303 ⎘