Shanghai
China
8
2020-05-07
The entities that hold a legal rights for patent applications filed by inventor Xia Hai:
Hai Xia from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:
Chip bonding apparatus and bonding method
#2 | 2020-01-09Universal chip batch-bonding apparatus and method
#3 | 2019-12-19Batch bonding apparatus and bonding method
#4 | 2019-12-12Chip bonding device
#5 | 2019-05-30Chip bonding device and bonding method thereof
#6 | 2019-03-21Chip bonding apparatus and method
#7 | 2017-12-28Six-degree-of-freedom linear motor
#8 | 2014-01-16Split type aerostatic bearing
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